This inventor holds 2 USPTO granted patents. Top assignee: Bookham Technology Limited. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Eric C Williams: Innovator in Mover Assembly Technology
Introduction
Eric C Williams is a notable inventor based in Los Alamos, NM (US). He has made significant contributions to the field of mover assembly technology, holding a total of 2 patents. His innovative designs focus on enhancing the efficiency and cleanliness of mover assemblies.
Latest Patents
Williams' latest patents include the "Sealed Mover Assembly" and the "Linear Output, Closed Loop Mover Assembly." The Sealed Mover Assembly is designed to move or position an object using a mover output connected to the object, with an actuator that facilitates movement. This assembly is notable for its housing, which seals the components within a clean, nonvolatile chamber, effectively isolating them from external contaminants. The Linear Output, Closed Loop Mover Assembly features a motor and a coupling assembly that allows for precise movement along a designated axis. This design includes a stage that couples the motor output to the object and a stage guide that ensures controlled motion.
Career Highlights
Eric C Williams is currently employed at Bookham Technology Limited, where he continues to develop innovative technologies. His work has significantly impacted the field of mover assemblies, showcasing his expertise and commitment to advancing engineering solutions.
Collaborations
Williams has collaborated with notable colleagues, including David F Arnone and Manish Sharma. These partnerships have contributed to the development of his patented technologies and further innovations in the field.
Conclusion
Eric C Williams stands out as a prominent inventor in mover assembly technology, with a focus on creating efficient and clean solutions. His contributions through patents and collaborations highlight his dedication to innovation in engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile