Washington, DC, United States of America

Er-Hsien Fu

This inventor holds 1 USPTO granted patent. Top assignee: Comtech Mobile Datacom Corporation. Active years: 2014.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2014

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Er-Hsien Fu: Innovator in Dynamic Spread Spectrum Technology

Introduction

Er-Hsien Fu is a notable inventor based in Washington, DC, recognized for his contributions to communication technology. He holds a patent that showcases his innovative approach to dynamic spread spectrum usage, which is essential for efficient signal transmission.

Latest Patents

Er-Hsien Fu's patent, titled "System and methods for dynamic spread spectrum usage," involves a sophisticated transmitter that sends signals to a receiver using spread spectrum signals. The transmitter generates a respective signal and separates it into multiple predefined portions, each below a noise floor. These portions are transmitted at discrete bandwidth intervals, utilizing a spread spectrum signal splitting technique. The receiver then reconstructs the respective signal using these predefined portions, ensuring effective communication.

Career Highlights

Er-Hsien Fu is associated with Comtech Mobile Datacom Corporation, where he applies his expertise in communication technologies. His work has significantly impacted the field, particularly in enhancing the reliability and efficiency of signal transmission.

Collaborations

One of his notable coworkers is Scott A McDermott, with whom he collaborates on various projects within the company.

Conclusion

Er-Hsien Fu's innovative work in dynamic spread spectrum technology exemplifies the advancements in communication systems. His contributions continue to influence the industry and pave the way for future developments.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…