Eon-Soo Jang

Title: Eon-Soo Jang: Innovator in Semiconductor Packaging

Introduction

Eon-Soo Jang is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative methods that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Eon-Soo Jang's latest patents include a stack package and a method of manufacturing the stack package. In this method, a first semiconductor chip is formed on a first package substrate, while a second semiconductor chip is formed on a second package substrate. A plurality of signal pads and a thermal diffusion member are formed on the interposer substrate, with the thermal diffusion member designed to contact the upper surface of the first semiconductor chip or the lower surface of the second package substrate. Additionally, he has developed a package substrate that includes an insulating substrate, internal circuits, and a warpage-suppressing member. This design aims to suppress warpage during the reflow process, ensuring the integrity of the semiconductor package.

Career Highlights

Eon-Soo Jang is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in packaging solutions.

Collaborations

Throughout his career, Eon-Soo Jang has collaborated with notable colleagues, including Jae-Choon Kim and Eun-Hee Jung. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Eon-Soo Jang's contributions to semiconductor packaging through his innovative patents highlight his expertise and commitment to advancing technology in this field. His work continues to influence the industry and pave the way for future innovations.