Shanghai, China

Enxin Lin

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Honeywell International Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Enxin Lin. Retrieved from https://idiyas.com/inventor/enxin-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Enxin Lin: Innovator in Heat Transfer Technology

Introduction

Enxin Lin is a prominent inventor based in Shanghai, China. She has made significant contributions to the field of heat transfer technology. Her innovative approach has led to the development of advanced heat pipes that enhance thermal performance.

Latest Patents

Enxin Lin holds a patent for "Low-pressure heat pipes and heat transfer methods using low-pressure for heat pipes." This patent describes the use of low-pressure working fluids charged with a minimal level of non-condensable gases, resulting in heat pipes that outperform traditional aluminum plates in thermal performance without incurring additional costs for degassing. She has 1 patent to her name.

Career Highlights

Enxin Lin is currently employed at Honeywell International Inc., where she continues to innovate in the field of heat transfer. Her work has garnered attention for its practical applications and efficiency improvements in thermal management systems.

Collaborations

Enxin has collaborated with notable colleagues, including Tao Liu and Yong Zhou, who have contributed to her research and development efforts.

Conclusion

Enxin Lin's contributions to heat transfer technology exemplify her innovative spirit and dedication to advancing engineering solutions. Her work continues to influence the industry and improve thermal performance in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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