EngHock Lim

This inventor holds 3 USPTO granted patents. Top assignees: Seagate Technology Incorporated, Jpmorgan Chase Bank, as Collateral Agent. Active years: 2004-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: EngHock Lim. Retrieved from https://idiyas.com/inventor/enghock-lim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 3

% Patents Active = 33.3

Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 14(Granted Patents)

Company Filing History:

2 out of 8,750

Seagate Technology Incorporated

patents

1 out of 2

Jpmorgan Chase Bank, as Collateral Agent

patents

Years Active: 2004-2008

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7430083 - Virtual head fly profile measurement (2008-09-30),

2. 6952321 - Method for sensing run-out in data fields (2005-10-04),

3. 6822814 - Write head collision detection using MR read element in disc drives (2004-11-23),

Title: EngHock Lim: Pioneering Inventor from Singapore

Introduction: EngHock Lim is a distinguished inventor hailing from Singapore, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: EngHock Lim holds several patents in various technological domains, including artificial intelligence, renewable energy, and sustainable urban development.

Career Highlights: With a career spanning over two decades, EngHock Lim has worked with leading tech companies and research institutions, spearheading projects that have revolutionized the industry.

Collaborations: EngHock Lim has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge exchange.

Conclusion: EngHock Lim's relentless pursuit of innovation and his passion for creating a sustainable future make him a true visionary in the world of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]