Eng Hwa Tan

Title: Eng Hwa Tan: Innovator in Integrated Circuit Packaging

Introduction

Eng Hwa Tan is a notable inventor based in Malacca, Malaysia. He has made significant contributions to the field of integrated circuit (IC) packaging. With a total of 2 patents to his name, his work focuses on improving the efficiency and cost-effectiveness of power packages.

Latest Patents

Eng Hwa Tan's latest patents include the "Sawn Power Package and Method of Fabricating Same." In one embodiment of this invention, a lead-frame is designed for use in IC packages that conform to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded to expose a portion of the leads. The device areas can then be singulated by sawing, similar to conventional QFN packages. This innovative approach allows for the production of packages conforming to power package standards, such as the TO 220 standard, much quicker and cheaper than traditional trim and forming methods.

Career Highlights

Eng Hwa Tan is currently employed at National Semiconductor Corporation, where he continues to develop cutting-edge technologies in the field of semiconductor packaging. His work has been instrumental in advancing the capabilities of IC packages, making them more efficient and cost-effective.

Collaborations

Throughout his career, Eng Hwa Tan has collaborated with talented individuals such as Santhiran S/o Nadarajah and Peng Soon Lim. These collaborations have contributed to the successful development of his innovative patents.

Conclusion

Eng Hwa Tan's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and efficiency. His patents reflect a deep understanding of the industry's needs and a drive to improve existing technologies. Eng Hwa Tan continues to be a significant figure in the realm of semiconductor advancements.