Springfield, MO, United States of America

Enayat O Karimian

This inventor holds 1 USPTO granted patent. Top assignee: Dayco IP Holdings, LLC. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Enayat O Karimian. Retrieved from https://idiyas.com/inventor/enayat-o-karimian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Enayat O Karimian: Innovator in Modular Molding Systems

Introduction

Enayat O Karimian is a notable inventor based in Springfield, MO (US). She has made significant contributions to the field of molding systems, showcasing her innovative spirit through her patented designs.

Latest Patents

Karimian holds a patent for a Modular Molding System. This system features a component formed in a generally closed loop shape, equipped with a plurality of radially extending teeth. The design includes multiple discrete segments that are coupled together, enhancing the functionality and versatility of the molding process. She has 1 patent to her name.

Career Highlights

Enayat O Karimian is currently associated with Dayco IP Holdings, LLC, where she continues to develop and refine her innovative ideas. Her work in this company reflects her commitment to advancing technology in the molding industry.

Collaborations

Throughout her career, Karimian has collaborated with talented individuals such as Randall R Diefenderfer and Randy C Foster. These partnerships have contributed to her success and the development of her innovative projects.

Conclusion

Enayat O Karimian stands out as a pioneering inventor in the field of modular molding systems. Her contributions and innovative designs continue to influence the industry, showcasing her dedication to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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