Henderson, NV, United States of America

Emma Chao

This inventor holds 1 USPTO granted patent. Top assignee: University of Nevada. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Emma Chao. Retrieved from https://idiyas.com/inventor/emma-chao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Emma Chao - Innovator in 3D Printing Technology

Introduction

Emma Chao is a prominent inventor based in Henderson, NV (US). She has made significant contributions to the field of 3D printing technology. Her innovative approach has led to the development of a unique modular and expandable 3D printer.

Latest Patents

Emma Chao holds a patent for a Modular Expandable 3D Printer. This invention features a modular and expandable frame that includes frame members designed to be coupled together, forming a base that defines an inner area. Each frame member is equipped with at least one coupling member, allowing for the removable connection of frame members. The printer frame also incorporates first modular plates and second modular plates, which can be coupled together to define a printer footprint.

Career Highlights

Emma Chao is affiliated with the University of Nevada, where she continues to advance her research and development in 3D printing technologies. Her work has garnered attention for its innovative design and practical applications in various industries.

Collaborations

Emma collaborates with talented individuals such as Kwang Jin Kim and Alexandrea Washington, contributing to a dynamic research environment.

Conclusion

Emma Chao's contributions to 3D printing technology exemplify her innovative spirit and dedication to advancing the field. Her patent for a modular and expandable 3D printer showcases her ability to create practical solutions that can benefit various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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