San Francisco, CA, United States of America

Elwin Ching Yee Ong

This inventor holds 15 USPTO granted patents and 2 published patent applications, plus 2 CIPO patents and 2 EPO patents, primarily in Card Construction. Top assignee: Capital One Services, LLC. Active years: 2019-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Elwin Ching Yee Ong. Retrieved from https://idiyas.com/inventor/elwin-ching-yee-ong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 15 

% Patents Active = 100.0


 

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • McLean, VA (US) (2022)
  • San Francisco, CA (US) (2019 - 2024)

Company Filing History:


Years Active: 2019-2024

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Areas of Expertise:
Transaction Card
Two-Piece Construction
Molded Pocket
Multilayer Composite
Card Design
Composite Backing
Card Manufacturing
Durability
Security Features
Structural Integrity
Material Composition
15 patents (USPTO):Explore Patents

Title: Inventor Elwin Ching Yee Ong

Introduction: Elwin Ching Yee Ong is a prolific inventor based in San Francisco, CA, known for his groundbreaking contributions to various fields.

Latest Patents: Elwin Ching Yee Ong holds several patents in the areas of technology, healthcare, and sustainability, showcasing his diverse range of expertise.

Career Highlights: With a career spanning over two decades, Elwin Ching Yee Ong has worked with leading companies to develop innovative solutions that have had a significant impact on industries worldwide.

Collaborations: Throughout his career, Elwin Ching Yee Ong has collaborated with top researchers, engineers, and scientists to bring cutting-edge ideas to life, fostering a culture of innovation and excellence.

Conclusion: Elwin Ching Yee Ong's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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