Elmer Senorin Holgado

Title: Elmer Senorin Holgado: Innovator in Package Lead Design

Introduction

Elmer Senorin Holgado is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of electronics through his innovative designs. His work primarily focuses on improving the efficiency and functionality of lead frames used in semiconductor devices.

Latest Patents

Holgado holds a patent for a "Package lead design with grooves for improved dambar separation." This invention features a lead frame that includes a die pad, a first lead extending away from the die pad, and a peripheral structure mechanically connected to both the first lead and the die pad. Notably, the design incorporates a first groove in the outer surface of the first lead, which extends longitudinally away from the die pad. This innovation aims to enhance the separation of dambar, thereby improving the overall performance of the lead frame.

Career Highlights

Elmer Senorin Holgado is currently employed at Infineon Technologies AG, a leading company in the semiconductor industry. His role involves developing advanced packaging solutions that meet the evolving demands of technology. With a focus on innovation, Holgado has established himself as a key player in his field.

Collaborations

Throughout his career, Holgado has collaborated with talented professionals, including Jayaganasan Narayanasamy and Meng How Chong. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Elmer Senorin Holgado's contributions to package lead design exemplify the spirit of innovation in the semiconductor industry. His patent and collaborative efforts highlight the importance of teamwork in advancing technology. Holgado's work continues to influence the field, paving the way for future advancements.