The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2022
Filed:
Jul. 12, 2019
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Jayaganasan Narayanasamy, Melaka, MY;
Meng How Chong, Melaka, MY;
Elmer Senorin Holgado, Melaka, MY;
Chee Ming Lam, Melaka, MY;
Sanjay Kumar Murugan, Melaka, MY;
Arivindran Navaretnasinggam, Melaka, MY;
Kai Yang Tan, Selangor, MY;
Lee Shuang Wang, Melaka, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/4842 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/49565 (2013.01); H01L 23/49582 (2013.01);
Abstract
A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.