Company Filing History:
Years Active: 2014
Title: **Elliott Simons: Innovator in 3D Chip Packaging Technology**
Introduction
Elliott Simons is a notable inventor based in Southborough, MA, recognized for his significant contributions to the field of semiconductor packaging. With a focus on advanced technological solutions, he holds a patent that showcases his innovative approach to 3D chip packaging.
Latest Patents
Elliott Simons holds a patent for a groundbreaking invention titled "3D Chip Package with Shielded Structures." This patent describes a sophisticated 3D chip package that features a carrier substrate containing first and second cavities. Within these cavities, there are first and second structures that incorporate electrical circuitry, enhancing the functionality and performance of electronic devices. The invention also includes a shield layer that is situated between the carrier substrate and the structures, providing critical isolation—electrically, magnetically, optically, or thermally. This shield layer may serve as a dielectric interface, improving the coupling between the structures. Furthermore, the structures can be homogeneous or heterogeneous, depending on the application.
Career Highlights
Elliott Simons is affiliated with Maxim Integrated Products, Inc., a company renowned for its innovative analog and mixed-signal products. His role at Maxim has been instrumental in advancing new packaging technologies that meet the growing needs of the semiconductor industry.
Collaborations
In his professional journey, Elliott has worked closely with talented colleagues, including Albert M Bergemont and Uppili Sridhar. These collaborations have enabled him to exchange ideas and drive innovation in the development of complex electronic systems.
Conclusion
Elliott Simons stands out as a forward-thinking inventor whose contributions to 3D chip packaging play a crucial role in the future of electronics. His patent reflects a deep understanding of both engineering principles and market needs, ensuring that his innovations remain relevant in an ever-evolving technology landscape.