York, PA, United States of America

Elizabeth A Deppen

This inventor holds 1 USPTO granted patent. Top assignee: Fci Americas Technology Inc.. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Elizabeth A Deppen. Retrieved from https://idiyas.com/inventor/elizabeth-a-deppen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Elizabeth A. Deppen

Introduction: Elizabeth A. Deppen is a notable inventor based in York, PA (US). He has made significant contributions to the field of electrical packaging through his innovative designs. With a focus on creating efficient and effective solutions, Deppen has secured a patent that showcases his expertise and creativity.

Latest Patents: Deppen holds a patent for an "Enclosure for electrical package and end piece therefore." This invention involves an enclosure that consists of a pair of half shells combined to define an interior cavity where the electrical package resides. The design allows for the interior cavity to be open at one end, with an end piece mounted to cover this opening, effectively closing the electrical package within the enclosure.

Career Highlights: Throughout his career, Deppen has demonstrated a commitment to innovation and excellence in his work. His patent reflects his ability to address practical challenges in electrical packaging, contributing to advancements in the industry.

Collaborations: Deppen has worked alongside talented colleagues, including James S. Staron and John M. Spickler, who have contributed to his projects and innovations.

Conclusion: Elizabeth A. Deppen's work exemplifies the spirit of innovation in the field of electrical packaging. His patent not only highlights his inventive capabilities but also underscores the importance of collaboration in achieving technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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