Miamisburg, OH, United States of America

Elijah R Perkins

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: C-Loop Packaging Sweden Ab. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Elijah R Perkins. Retrieved from https://idiyas.com/inventor/elijah-r-perkins

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Elijah R. Perkins

Introduction

Elijah R. Perkins is a notable inventor based in Miamisburg, Ohio. He has made significant contributions to the field of packaging technology. With a focus on innovation, Perkins has secured a patent that showcases his inventive capabilities.

Latest Patents

Elijah R. Perkins holds a patent related to packaging solutions. His innovative approach has led to the development of a product that can effectively end packaging challenges. This patent highlights his commitment to advancing technology in the packaging industry. He has 1 patent to his name.

Career Highlights

Perkins is currently associated with C-Loop Packaging Sweden AB, where he continues to work on innovative packaging solutions. His role in the company allows him to collaborate with other talented professionals in the field. His career reflects a dedication to improving packaging methods and technologies.

Collaborations

Some of his notable coworkers include Nicholas Guy Paget and Paul F. Klips. Their collaboration fosters a creative environment that encourages innovation and the development of new ideas.

Conclusion

Elijah R. Perkins exemplifies the spirit of innovation in the packaging industry. His contributions and collaborations continue to shape the future of packaging technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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