Ekapong Tangpattanasaeree

Title: Ekapong Tangpattanasaeree: Innovator in Die Separation Technology

Introduction

Ekapong Tangpattanasaeree is a notable inventor based in Bangkok, Thailand. He has made significant contributions to the field of semiconductor technology, particularly in the area of die separation methods. His innovative approach has the potential to enhance the efficiency of integrated circuit manufacturing.

Latest Patents

Ekapong holds a patent for a method titled "Die separation using adhesive-layer laser scribing." This patent describes a process for wafer dicing and the removal of separated integrated circuit (IC) dies from a carrier substrate. The method involves mounting a wafer on a substrate using an adhesive layer, laser scribing the adhesive layer to create defect regions, and performing a breaking step to separate the adhesive layer into portions corresponding to the IC dies. This technique aims to achieve efficient adhesive-layer separation while reducing backside chipping associated with conventional blade dicing.

Career Highlights

Ekapong is currently employed at NXP B.V., where he continues to develop and refine his innovative techniques. His work has garnered attention for its potential to improve manufacturing processes in the semiconductor industry.

Collaborations

Ekapong has collaborated with several talented individuals in his field, including Siriluck Wongratanaporngoorn and Yao Jung Chang. These collaborations have contributed to the advancement of technology in die separation methods.

Conclusion

Ekapong Tangpattanasaeree is a pioneering inventor whose work in die separation technology is shaping the future of semiconductor manufacturing. His innovative methods promise to enhance efficiency and reduce defects in integrated circuit production.