Tokyo, Japan

Eitaro Fukutaka

This inventor holds 1 USPTO granted patent. Top assignee: Denka Company Limited. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eitaro Fukutaka. Retrieved from https://idiyas.com/inventor/eitaro-fukutaka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Eitaro Fukutaka: Innovator in Flat-Plate Bonding Technology

Introduction

Eitaro Fukutaka is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of manufacturing technology, particularly in the area of flat-plate bonding. His innovative approach has led to the development of a unique bonding jig that addresses common challenges in the industry.

Latest Patents

Fukutaka holds a patent for a "Flat-plate bonding jig and method of manufacturing flat-plate laminated body." This invention provides a jig with a structure that differs from conventional designs, enabling flat plates to be bonded while effectively suppressing air bubble formation. The jig features a first surface, a second surface with multiple suction holes for securing a flat plate, and a main body that connects these surfaces. Additionally, it includes a communication means that allows the suction holes to connect with a suction mechanism.

Career Highlights

Eitaro Fukutaka is associated with Denka Company Limited, where he has been instrumental in advancing manufacturing techniques. His work has not only improved efficiency but also enhanced the quality of laminated products in various applications.

Collaborations

Fukutaka has collaborated with notable colleagues, including Yukio Eda and Toshiyuki Ibayashi. Their combined expertise has contributed to the successful development and implementation of innovative technologies within their field.

Conclusion

Eitaro Fukutaka's contributions to flat-plate bonding technology exemplify the impact of innovation in manufacturing. His patent reflects a commitment to solving industry challenges and improving product quality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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