Company Filing History:
Years Active: 1990
Title: Eiki Zidai: Innovator in Thermosetting Insulating Resin Paste
Introduction
Eiki Zidai is a notable inventor based in Amagasaki, Japan. He has made significant contributions to the field of materials science, particularly in the development of thermosetting insulating resin pastes. His innovative work has implications for the semiconductor industry, enhancing production processes and device efficiency.
Latest Patents
Eiki Zidai holds a patent for a thermosetting insulating resin paste. This paste includes 100 parts by weight of an epoxy resin, primarily composed of a diglycidyl type liquid epoxy resin. The formulation also incorporates 0.5 to 10 parts by weight of dicyandiamide as a setting agent, along with 1 to 15 parts by weight of a phenoxy resin. Additionally, it contains 0.1 to 8 parts by weight of specific imidazole compounds as setting accelerators and 50 to 200 parts by weight of a thermally conductive filler. This innovative resin paste is designed to exhibit a long pot life and can be set quickly at low temperatures without voids, facilitating the die bonding process in semiconductor device production.
Career Highlights
Eiki Zidai is associated with Mitsubishi Electric Corporation, where he has been instrumental in advancing materials used in electronic applications. His work has not only contributed to the efficiency of semiconductor manufacturing but has also paved the way for smaller and more effective devices.
Collaborations
Eiki Zidai has collaborated with notable colleagues such as Masakazu Murayama and Ken Kimura. Their combined expertise has fostered innovation and development in the field of insulating materials.
Conclusion
Eiki Zidai's contributions to the development of thermosetting insulating resin pastes highlight his role as a key innovator in the semiconductor industry. His work continues to influence the efficiency and effectiveness of electronic device production.