Tokyo, Japan

Eiji Maehata

This inventor holds 2 USPTO granted patents. Top assignees: Nec Corporation, Sumitomo Bakelite Corporation Limited. Active years: 1996-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eiji Maehata. Retrieved from https://idiyas.com/inventor/eiji-maehata

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 1996-1999

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2 patents (USPTO):Explore Patents

Title: Eiji Maehata: Innovator in Printed Wiring Board Technology

Introduction

Eiji Maehata is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 2 patents. His innovative approaches have enhanced the reliability and efficiency of electronic components.

Latest Patents

Maehata's latest patents include a fabrication method of a printed wiring board. This method realizes high adhesion strength of a patterned conductive layer while maintaining high insulation reliability between adjacent conductive paths. The process begins with preparing an adhesive material, which is a mixture of a photo-setting resin, fine particles of a photolyzable resin, and a metal-organic compound. The adhesive material is coated on an insulative base material to form an adhesive layer. This layer is selectively exposed to light, curing the photo-setting resin and photolyzing the particles. The exposed adhesive layer is then developed using an alkaline developer solution, transferring the pattern from the mask and roughening the surface of the unexposed parts. The metal-organic compound in these unexposed areas is activated, revealing plating catalytic activity. Finally, a conductive layer is selectively formed on these areas through electroless plating.

Another notable patent is an adhesive for printed circuit boards. This adhesive consists of a dispersion of a resin that is soluble in an alkaline oxidizing agent after curing, within a resin matrix that is sparingly soluble in the same agent. This innovation provides a process for producing printed circuit boards using the aforementioned adhesive.

Career Highlights

Eiji Maehata has worked with notable companies such as NEC Corporation and Sumitomo Bakelite Corporation Limited. His experience in these organizations has contributed to his expertise in the field of electronics and materials science.

Collaborations

One of Maehata's notable coworkers is Toshio Komiyatani. Their collaboration has likely fostered advancements in their respective projects and innovations.

Conclusion

Eiji Maehata's contributions to printed wiring board technology through his patents and career experiences highlight his role as an influential inventor in the electronics industry. His work continues to impact the development of reliable electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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