Bardstown, KY, United States of America

Eiji Hikida

This inventor holds 1 USPTO granted patent. Top assignee: American Fuji Seal, Inc.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eiji Hikida. Retrieved from https://idiyas.com/inventor/eiji-hikida-uin3ifjj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Eiji Hikida: Innovator in Shrink Sleeve Film Technology

Introduction

Eiji Hikida is a notable inventor based in Bardstown, Kentucky, known for his contributions to packaging technology. He has made significant strides in the field, particularly with his innovative work on shrink sleeve film. His expertise and dedication to his craft have earned him recognition in the industry.

Latest Patents

Eiji Hikida holds a patent for shrink sleeve film, showcasing his ability to develop practical solutions for packaging needs. This invention is a testament to his innovative spirit and commitment to enhancing product presentation and protection.

Career Highlights

Hikida is currently employed at American Fuji Seal, Inc., where he continues to apply his skills and knowledge in packaging technology. His role at the company allows him to work on cutting-edge projects that push the boundaries of traditional packaging methods.

Collaborations

[This section has been skipped due to space constraints.]

Conclusion

Eiji Hikida's contributions to the field of packaging, particularly through his patent for shrink sleeve film, highlight his innovative approach and dedication to improving industry standards. His work at American Fuji Seal, Inc. continues to influence the packaging landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…