Kanagawa, Japan

Eiichiro Kaneko

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Toyo Seikan Co., Ltd.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eiichiro Kaneko. Retrieved from https://idiyas.com/inventor/eiichiro-kaneko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Eiichiro Kaneko: Innovator in Blow Molding Technology

Introduction

Eiichiro Kaneko is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of blow molding technology. His innovative approach has led to advancements that enhance the quality and efficiency of molded products.

Latest Patents

Kaneko holds a patent for a "Parison supply device and supply method, and blow molding machine and blow molding method using same." This invention focuses on a blow molding process that maintains uniform parison thickness distribution. It is designed to fabricate high-quality molded products while improving productivity. The parison supply device includes a pair of chucks that pinch the parison discharged from an extrusion die. The chuck operation part controls the pinching and movement of the chucks, allowing for efficient operation.

Career Highlights

Kaneko is associated with Toyo Seikan Co., Ltd., a company known for its innovative packaging solutions. His work has contributed to the company's reputation for quality and efficiency in manufacturing processes.

Collaborations

Kaneko has collaborated with notable coworkers, including Norihisa Hirota and Atsushi Yoneda. Their combined expertise has furthered advancements in blow molding technology.

Conclusion

Eiichiro Kaneko's contributions to blow molding technology exemplify innovation in manufacturing processes. His patent reflects a commitment to quality and efficiency in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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