Company Filing History:
Years Active: 2009
Title: Eiichi Kawashima: Innovator in Wafer Protective Technology
Introduction
Eiichi Kawashima is a notable inventor based in Ashikaga, Japan. He is recognized for his innovative contributions to the field of semiconductor technology, particularly in the development of protective materials for wafers. His work has significantly impacted the way wafers are handled and transported in the industry.
Latest Patents
Kawashima holds a patent for a wafer protective sheet. This protective sheet is made of a synthetic resin with a thickness ranging from 80 to 130 micrometers. It features a unique design with numerous projected and recessed parts on both its front and rear surfaces. The arrangement of these parts is such that they are positioned at the intersections of lattice stripes, alternating between projected and recessed features. This design allows for a water-like cross-section, ensuring that the recessed parts on the rear surface align with the projected parts on the front surface, and vice versa. The wafer protective sheet boasts a bending resistance of 30 to 80 mm, making it sufficiently thin to protect wafers without adhering to them when interposed between stacked wafers. This innovation effectively safeguards wafers against vibrations during transportation.
Career Highlights
Eiichi Kawashima is associated with Achilles Corporation, where he has made significant strides in his field. His work has not only advanced the technology of wafer protection but has also contributed to the overall efficiency of semiconductor manufacturing processes.
Collaborations
Kawashima has collaborated with notable colleagues, including Masahiko Fuyumuro and Yoshitaka Nakayama. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Eiichi Kawashima's contributions to the development of wafer protective technology exemplify his commitment to innovation in the semiconductor industry. His patented designs continue to influence the way wafers are protected and transported, ensuring their integrity and performance.