Eschenbach, Switzerland

Egon Seegers

This inventor holds 1 USPTO granted patent. Top assignee: Accelleron Switzerland Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Egon Seegers. Retrieved from https://idiyas.com/inventor/egon-seegers

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Egon Seegers

Introduction

Egon Seegers is a notable inventor based in Eschenbach, Switzerland. He has made significant contributions to the field of additive manufacturing, particularly in the development of methods that enhance the efficiency of producing complex components.

Latest Patents

Egon Seegers holds a patent for a "Method for removal of support structures of additive manufactured components by pressurized jet." This innovative method involves the manufacturing of a vaned component for a turbomachine. The process includes creating a base portion, additively manufacturing a plurality of vanes and support structures with predetermined breaking points, and applying a pressurized jet to remove the support structures effectively.

Career Highlights

Egon Seegers is currently employed at Accelleron Switzerland Ltd., where he continues to push the boundaries of technology in additive manufacturing. His work focuses on improving manufacturing processes and enhancing the performance of turbomachinery components.

Collaborations

Egon collaborates with talented individuals such as Timo Schudeleit and Lukas Gampp, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Egon Seegers exemplifies the spirit of innovation in the field of additive manufacturing. His contributions, particularly through his patented methods, are paving the way for advancements in turbomachine technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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