Petach-Tikva, Israel

Efrat Levy

This inventor holds 1 USPTO granted patent. Top assignee: Magnisity Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Efrat Levy. Retrieved from https://idiyas.com/inventor/efrat-levy-6tu0pczs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Efrat Levy: Inventor of a Flexible Electronic Device

Introduction

Efrat Levy is an inventor based in Petach-Tikva, Israel, and is associated with Magnisity Ltd. Her listed patent concerns integrating a sensor-bearing flexible printed circuit into a bendable section of an elongated device.

Latest Patents

Levy’s listed patent is titled “Embedding of a Circuit of Electronic Components in a Bendable Section of an Elongated Flexible Device.” It describes assembling a flexible printed circuit (FPC), with at least one sensor attached, across a bendable section formed by serially connected links. The FPC subassembly is then threaded into an outer tube. The approach is intended to integrate electronic components into an elongated device while preserving its flexibility. Levy is credited with 1 patent.

Career Highlights

The available information identifies Levy’s work through this patent and her association with Magnisity Ltd. The invention focuses on the assembly of flexible electronics within a bendable device structure.

Collaborations

Levy is listed alongside coworker Dror Gardosh. The provided information does not specify their respective roles in developing the patented technology.

Conclusion

Efrat Levy’s listed invention addresses the integration of sensor-equipped flexible circuitry into an elongated, bendable device, highlighting a practical approach to combining electronics and mechanical flexibility.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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