Enfield, CT, United States of America

Edwin R Holtz

This inventor holds 3 USPTO granted patents. Top assignee: Loctite Corporation. Active years: 1987-1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Edwin R Holtz. Retrieved from https://idiyas.com/inventor/edwin-r-holtz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 1987-1990

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3 patents (USPTO):Explore Patents

Title: Edwin R. Holtz: Innovator in Bonding Technologies

Introduction

Edwin R. Holtz is a notable inventor based in Enfield, CT (US), recognized for his contributions to bonding technologies. With a total of 3 patents, he has developed innovative solutions that enhance manufacturing processes.

Latest Patents

Holtz's latest patents include an "Apparatus for producing an atmosphere other than ambient" and a "Bonding apparatus with electromagnetic wave generator." These inventions focus on bonding core members to housing members, particularly in situations where the members do not mate in a contiguous fashion. The processes he developed incorporate both manual and semi-automatic functions, but are primarily automated and computer-controlled. A conveyor system is utilized to carry an assembly of initially joined but unbonded components through a series of discrete stations.

In the bonding process, an initial continuous bead of sealant is applied to one side of the assembly, creating a cavity between the members. This bead is cured, and the assembly is then inverted to fill the cavity with an anaerobic bonding material. A second continuous bead of sealant is applied to the opposite side to seal the remaining space and isolate the bonding material. After curing the second bead, the fully bonded assembly is removed, allowing for a fresh assembly to be processed.

Career Highlights

Holtz has made significant strides in the field of bonding technologies during his career at Loctite Corporation. His work has contributed to advancements in automated manufacturing processes, improving efficiency and reliability in production.

Collaborations

Throughout his career, Holtz has collaborated with notable coworkers such as William A. Gelinas and Dennis J. Argazzi, further enhancing the innovative environment at Loctite Corporation.

Conclusion

Edwin R. Holtz's contributions to bonding technologies through his patents and work at Loctite Corporation exemplify his commitment to innovation in manufacturing processes. His inventions continue to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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