Company Filing History:
Years Active: 2001
Title: Innovations of Edwin L Tom in Wafer Technology
Introduction
Edwin L Tom is a notable inventor based in Richardson, TX (US), recognized for his contributions to wafer technology. He holds 2 patents that showcase his innovative approaches to breaking and separating wafers into die with high aspect ratios. His work is particularly significant in the semiconductor industry, where precision and efficiency are paramount.
Latest Patents
One of Edwin L Tom's latest patents is a method and apparatus for breaking a wafer into die having a high aspect ratio. In this invention, a multi-radii dome is utilized to controllably break the wafer in two directions. The two different dome curvatures provide an even, controlled force along the kerfs in both the X-direction and the Y-direction. Another embodiment features a cylindrical dome that is curved in the Y-direction and flat in the X-direction, which is used to break a wafer into die with exceptionally high aspect ratios. This invention significantly reduces the likelihood of die fracture during the wafer break process. The wafer is mounted on stretchable wafer tape during the break process to prevent the die edges from contacting and rubbing against one another after the break. This innovative method allows for the separation of die with exceptionally large aspect ratios, such as those having a 1:25 aspect ratio.
Career Highlights
Edwin L Tom is currently employed at Texas Instruments Corporation, where he continues to develop and refine technologies related to wafer processing. His work has had a substantial impact on the efficiency and reliability of semiconductor manufacturing processes.
Collaborations
Throughout his career, Edwin has collaborated with notable colleagues, including Robert G McKenna and R Scott Croff. These collaborations have contributed to the advancement of technologies in the field of semiconductor manufacturing.
Conclusion
Edwin L Tom's innovative contributions to wafer technology demonstrate his expertise and commitment to advancing the semiconductor industry. His patents reflect a deep understanding of the challenges in wafer processing and offer solutions that enhance efficiency and reduce defects.