Edward M Majors

Title: Edward M Majors: Innovator in Semiconductor Packaging

Introduction

Edward M Majors is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through his innovative designs. His work has been recognized within the industry, particularly during his tenure at Motorola Corporation.

Latest Patents

Edward M Majors holds a patent for a semiconductor package having an exposed die surface. This innovative semiconductor package features a die with a first surface that includes a plurality of bond pads and a second surface that remains exposed. The design allows for inner lead portions of a TAB leadframe to be coupled to the bond pads, with outer lead portions extending from them. An encapsulation is applied to the first surface of the die, which includes the bond pads and the inner lead portions of the TAB leadframe. This encapsulation also surrounds the sides of the die, resulting in a relatively thin package that offers superior thermal dissipation properties.

Career Highlights

Throughout his career, Edward has been associated with Motorola Corporation, where he has contributed to advancements in semiconductor technology. His innovative approach has led to the development of efficient packaging solutions that enhance the performance of semiconductor devices.

Collaborations

Edward has collaborated with notable colleagues, including Francis J Carney, Jr and James H Knapp. These partnerships have fostered an environment of innovation and creativity, leading to significant advancements in their field.

Conclusion

Edward M Majors is a distinguished inventor whose work in semiconductor packaging has made a lasting impact on the industry. His innovative designs and collaborations have paved the way for advancements that continue to benefit technology today.