This inventor holds 2 USPTO granted patents. Top assignee: Pymah Corporation. Active years: 1990.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1990
Title: Innovations by Edmund B. Wilson, III
Introduction
Edmund B. Wilson, III is a notable inventor based in Randolph, NJ (US). He has made significant contributions to the field of thermal protection for sensitive goods. With a total of 2 patents, his work focuses on innovative heat sink technologies.
Latest Patents
Wilson's latest patents include a "Modular Heat Sink Package" and "Heat Sink Protective Packaging for Thermolabile Goods." The modular heat sink package features improved designs for protecting thermolabile goods from high ambient shipping temperatures. It can be configured to various box sizes and used in both flat and folded configurations. The heat sink dimensions are correlated to multiple box sizes, allowing for versatile applications. The second patent describes a heat sink composition that includes sodium sulfate and a hydrophilic suspension agent, designed to protect thermolabile goods from degradation due to high temperatures.
Career Highlights
Wilson is currently employed at Pymah Corporation, where he continues to develop innovative solutions for thermal protection. His work has garnered attention for its practical applications in shipping and packaging.
Collaborations
Some of his notable coworkers include Willem H. Van Iperen and Robert S. Golabek, Jr. Their collaboration has contributed to the advancement of thermal protection technologies.
Conclusion
Edmund B. Wilson, III's contributions to the field of thermal protection through his innovative patents demonstrate his commitment to improving the safety of thermolabile goods during shipping. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile