Wedel, Germany

Eckehard Schmidt

This inventor holds 1 USPTO granted patent. Top assignee: Licentia Patent-Verwaltungs Gmbh. Active years: 1982.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eckehard Schmidt. Retrieved from https://idiyas.com/inventor/eckehard-schmidt-qbqcm179

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1982

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Eckehard Schmidt

Introduction

Eckehard Schmidt is a notable inventor based in Wedel, Germany. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for embedding semiconductor components in plastics.

Latest Patents

Eckehard Schmidt holds a patent for a method of embedding semiconductor components in plastics. This method involves inserting components into the plastics material and subsequently hardening the plastics through irradiation with high energy beams. This innovative technique enhances the integration of semiconductor devices into various applications.

Career Highlights

Eckehard Schmidt is associated with Licentia Patent-Verwaltungs GmbH, where he continues to contribute to advancements in technology. His work has been instrumental in bridging the gap between semiconductor technology and plastic materials.

Collaborations

Throughout his career, Eckehard has collaborated with esteemed colleagues such as Dieter Rusch and Manfred Tauber. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Eckehard Schmidt's contributions to the field of semiconductor technology through his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence the integration of technology in everyday materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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