Company Filing History:
1 out of 79 
1 out of 42 Years Active: 2016
Title: Echan Liu - Innovator in Wireless Module Technology
Introduction
Echan Liu is a notable inventor based in Caotun, Taiwan. He has made significant contributions to the field of wireless technology, particularly through his innovative designs and patents. His work focuses on enhancing the efficiency and effectiveness of wireless communication systems.
Latest Patents
Echan Liu holds a patent for a "Wireless module with integrated antenna by using rigid-flex board." This invention includes a flex substrate with an integrated antenna that is electrically connected to both a signal layer and a ground layer. The design features a first rigid substrate stacked on one side of the flex substrate, which is remote from the antenna. A communication unit is mounted on this rigid substrate and is also electrically connected to the signal layer. This configuration allows the flex substrate and the first rigid substrate to be laminated into a Rigid-Flex board. The arrangement of the signal layer and ground layer within the same flex substrate helps to decrease uncertainty and loss in RF signal transmission paths, reduce component costs, facilitate antenna optimization, and minimize module size.
Career Highlights
Echan Liu has worked with several prominent companies in the technology sector. Notably, he has been associated with Universal Scientific Industrial (Shanghai) Co., Ltd. and Universal Global Scientific Industrial Co., Ltd. His experience in these organizations has contributed to his expertise in wireless technology and innovation.
Collaborations
Echan Liu has collaborated with talented professionals in his field, including Hsin-Hong Chen and Ruei-Kun Shih. These collaborations have likely enriched his work and led to further advancements in wireless technology.
Conclusion
Echan Liu's contributions to wireless module technology demonstrate his innovative spirit and commitment to improving communication systems. His patent reflects a significant advancement in the field, showcasing his ability to integrate complex technologies into practical solutions.