The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Feb. 27, 2014
Applicants:

Universal Scientific Industrial (Shanghai) Co., Ltd, Shanghai, CN;

Universal Global Scientific Industrial Co., Ltd, Caotun Township, Nanotu County, TW;

Inventors:

Hsin-Hong Chen, Taichung, TW;

Ruei-Kun Shih, Caotun Township, Nantou County, TW;

Echan Liu, Caotun Township, Nantou County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/2208 (2013.01); H01Q 23/00 (2013.01);
Abstract

A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate. It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size.


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