Chemnitz, Germany

Eberhard Kaulfersch


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Eberhard Kaulfersch: Innovator in Chip Arrangement Technology

Introduction

Eberhard Kaulfersch is a notable inventor based in Chemnitz, Germany. He has made significant contributions to the field of chip arrangement technology, particularly with his innovative patent that enhances the connection between chips and substrates.

Latest Patents

Kaulfersch holds a patent for a "Chip arrangement and method of producing the same." This invention features a chip arrangement that includes a first chip, a connecting device, and at least a second chip or substrate. The connecting device is designed with multiple individual, spaced diamond parts that facilitate the connection between the chips or between the first chip and the substrate. This method is particularly advantageous for connecting high-power chips to heat sinks, ensuring efficient thermal management.

Career Highlights

Eberhard Kaulfersch is associated with the Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., a prestigious research organization in Germany. His work focuses on advancing technologies that improve the performance and reliability of electronic components.

Collaborations

Kaulfersch has collaborated with notable colleagues, including Manfred Topfer and Stefan Weib, who share his commitment to innovation in the field of applied research.

Conclusion

Eberhard Kaulfersch's contributions to chip arrangement technology exemplify the impact of innovative thinking in the electronics industry. His patent reflects a significant advancement in connecting high-power chips, showcasing his expertise and dedication to research and development.

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