Strasburg, PA, United States of America

E Michael Ames

This inventor holds 1 USPTO granted patent. Top assignee: Advanced Cooling Technologies, Inc.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: E Michael Ames. Retrieved from https://idiyas.com/inventor/e-michael-ames

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: E Michael Ames: Innovator in Heat Transfer Technology

Introduction

E Michael Ames is a notable inventor based in Strasburg, PA (US). He has made significant contributions to the field of heat transfer technology, particularly with his innovative designs that enhance the efficiency of thermal management systems.

Latest Patents

Ames holds a patent for a heat transferring clamp. This apparatus features a heat pipe that connects the clamp's stationary base part to each moveable clamping part. The design includes a flexible connecting heat pipe section that allows for the necessary clamping and unclamping movements. This innovation provides a superior heat transfer path between a clamped circuit board or other devices and an available heat sink.

Career Highlights

Ames is associated with Advanced Cooling Technologies, Inc., where he applies his expertise in thermal management solutions. His work focuses on developing technologies that improve heat transfer efficiency in various applications.

Collaborations

Some of his coworkers include Daniel T Reist and Scott D Garner, who contribute to the innovative environment at Advanced Cooling Technologies, Inc.

Conclusion

E Michael Ames is a key figure in the development of heat transfer technologies, with a patent that showcases his innovative approach to thermal management. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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