Salinas, CA, United States of America

Dwight Cornwell


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2007-2008

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Dwight Cornwell

Introduction

Dwight Cornwell is a notable inventor based in Salinas, CA (US). He has made significant contributions to the field of thin film technology, holding a total of 2 patents. His work focuses on advanced methods for fabricating thin film components, which are essential in various electronic applications.

Latest Patents

Cornwell's latest patents include an innovative image transfer process for thin film component definition. This method involves several steps, starting with the formation of a wafer that includes a thin film layer, a release layer, and a patterned layer of photoresist. The process transfers the pattern from the photoresist layer to both the release layer and the thin film layer. A layer of metal is then added to the wafer, which is heated to a predetermined temperature. This heating causes deformation of the photoresist, resulting in cracks in the metal layer. A solvent is applied to dissolve the release layer, allowing it to penetrate through the cracks in the metal. Finally, the release layer and any material above it are removed, completing the fabrication process.

Career Highlights

Cornwell is currently associated with Hitachi Global Storage Technologies Netherlands B.V., where he continues to innovate in the field of storage technologies. His expertise in thin film processes has positioned him as a valuable asset in the company.

Collaborations

He has worked alongside Douglas Johnson Werner, contributing to advancements in their shared field of expertise.

Conclusion

Dwight Cornwell's contributions to thin film technology through his patents and work at Hitachi Global Storage Technologies highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of electronic component fabrication.

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