Ho Chi Minh City, Vietnam

Duy Cong Nguyen

This inventor holds 1 USPTO granted patent. Top assignee: Vetco Gray Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Duy Cong Nguyen. Retrieved from https://idiyas.com/inventor/duy-cong-nguyen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Duy Cong Nguyen: Innovator in Sealing Technology

Introduction

Duy Cong Nguyen is a notable inventor based in Ho Chi Minh City, Vietnam. He has made significant contributions to the field of sealing technology, particularly with his innovative designs that enhance the efficiency and reliability of metallic seals.

Latest Patents

Duy Cong Nguyen holds a patent for a "Radial sealing surface system and method." This invention features a metallic seal that includes a first leg with a first sealing profile and a second leg with a second sealing profile. The design incorporates an inner bore with two different inner diameters. Additionally, the seal has a first radial contact point along the first sealing profile and a second radial contact point along the second sealing profile, where the second contact point has a larger outer diameter than the first.

Career Highlights

Duy Cong Nguyen is currently employed at Vetco Gray Inc., where he applies his expertise in sealing technology. His work has contributed to advancements in the industry, showcasing his commitment to innovation and quality.

Collaborations

Duy has collaborated with talented individuals such as Joseph Shu Yian Liew and Mark James Bridges, further enhancing the innovative environment at Vetco Gray Inc.

Conclusion

Duy Cong Nguyen's contributions to sealing technology through his patent and work at Vetco Gray Inc. highlight his role as a significant inventor in the field. His innovative designs continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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