Exmall, United Kingdom

Duncan M Price

This inventor holds 1 USPTO granted patent. Top assignee: Ta Instruments, Inc.. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Duncan M Price. Retrieved from https://idiyas.com/inventor/duncan-m-price-910jb1so

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Innovations of Duncan M Price

Introduction

Duncan M Price is a notable inventor based in Exmall, GB. He has made significant contributions to the field of thermomechanical analysis through his innovative patent. His work focuses on enhancing the understanding of material behavior under varying temperature conditions.

Latest Patents

Duncan M Price holds a patent titled "Method and apparatus for modulated-temperature thermomechanical analysis." This invention employs a 'modulated-temperature' heating program composed of a series of heat-isotherm stages. It allows for the separation of the change in dimensions of an oriented material during heating into two contributions. The first is a thermally 'reversing' component due to linear thermal expansion, while the second is a 'non-reversing' part arising from relaxation to the disordered state on heating above T.sub.g. Preliminary results for biaxially drawn poly(ethylene terephthalate) film are also presented in this patent.

Career Highlights

Duncan M Price is associated with TA Instruments, Inc., where he applies his expertise in thermomechanical analysis. His work at the company has contributed to advancements in material science and engineering.

Collaborations

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Conclusion

Duncan M Price's innovative work in thermomechanical analysis showcases his dedication to advancing material science. His patent reflects a significant step forward in understanding material behavior under thermal conditions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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