Hangzhou, China

Dun Qian

This inventor holds 1 USPTO granted patent. Top assignee: Electric Power Research Institute of State Grid Zhejiang Electric Power Co., Ltd. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dun Qian. Retrieved from https://idiyas.com/inventor/dun-qian

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Dun Qian and a High Anti-Interference Microsystem for Power Grids.

Introduction

Dun Qian is an inventor associated with Hangzhou, China. His patent work addresses the challenge of protecting power-grid electronics from external magnetic interference.

Latest Patents

The provided information lists 1 patent for Dun Qian: “High Anti-Interference Microsystem Based on System in Package (SIP) for Power Grid.” The invention describes a microsystem built around a ceramic cavity and substrate, with a magnetic cover plate forming a sealed enclosure. Digital signal processing and analog signal conditioning circuits on the substrate process received signals, while an external shield helps block magnetic interference.

Career Highlights

Qian is associated with the Electric Power Research Institute of State Grid Zhejiang Electric Power Co., Ltd. His listed patent focuses on packaging and shielding techniques intended to improve the reliability of electronic systems used in power-grid applications.

Collaborations

The provided information names Xianjun Shao and Xiaoxin Chen as Qian’s coworkers. Their specific roles in the patent or related research are not stated.

Conclusion

Dun Qian’s listed invention combines sealed system-in-package construction, signal-processing circuits, and magnetic shielding to address interference in power-grid microsystems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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