This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: Korea Institute of Science and Technology, Sungkyunkwan University. Active years: 2026.
Company Filing History:
1 out of 2,244 
1 out of 1,347 
Years Active: 2026
Title: Duhwan Seong: Innovator in Device Assembly Technology
Introduction
Duhwan Seong is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of device assembly technology, particularly through his innovative patent.
Latest Patents
Duhwan Seong holds a patent for a "Device assembly, device module including the device assembly, and device package including the device module." This invention features a device assembly that includes a substrate for mounting a device, electrodes for electrical connection, and an encapsulation made of a self-healing polymer (SHP). The electrodes are composed of a conductive polymer composite that includes the SHP, enhancing the durability and functionality of the device.
Career Highlights
Throughout his career, Duhwan Seong has worked with prestigious institutions such as the Korea Institute of Science and Technology and Sungkyunkwan University. His work in these organizations has allowed him to advance his research and contribute to the development of innovative technologies.
Collaborations
Duhwan Seong has collaborated with notable colleagues, including In Soo Kim and Donghee Son. Their combined expertise has fostered advancements in their respective fields.
Conclusion
Duhwan Seong's contributions to device assembly technology highlight his innovative spirit and dedication to research. His patent and collaborations reflect his commitment to advancing technology in meaningful ways.