Suwon, South Korea

Duck-Bae Park

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2011.


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Duck-Bae Park: Innovator in Hinge Technology

Introduction

Duck-Bae Park is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of portable technology through his innovative designs. His work primarily focuses on hinge mechanisms that enhance the functionality of portable devices.

Latest Patents

One of Duck-Bae Park's key patents is a hinge apparatus for portable terminals. This invention includes a first housing and a second housing that is rotatably connected to the first housing. The hinge apparatus features a first connection terminal mounted on the first housing and a second connection terminal mounted on the second housing. A connection member reciprocates between these terminals while allowing the second housing to rotate. This design ensures that the connection member contacts the first connection terminal when the second housing is folded, and it moves away when the second housing rotates. This innovative hinge design improves the usability of portable terminals.

Career Highlights

Duck-Bae Park is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to be at the forefront of innovation in portable technology. With a total of 1 patent, he has demonstrated his ability to create practical solutions for modern devices.

Collaborations

Duck-Bae Park has collaborated with talented coworkers such as Kwang-Ho Jung and Seung-hoon Lee. Their teamwork has contributed to the development of advanced technologies within the company.

Conclusion

Duck-Bae Park is an influential inventor whose work in hinge technology has the potential to enhance the functionality of portable devices. His innovative designs continue to shape the future of technology.

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