Singapore, Singapore

Duc-Viet Nguyen

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: National University of Singapore. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Duc-Viet Nguyen. Retrieved from https://idiyas.com/inventor/duc-viet-nguyen-lxtpopb9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Duc-Viet Nguyen: Innovator in Microneedle Technology

Introduction

Duc-Viet Nguyen is a prominent inventor based in Singapore, known for his innovative contributions to the field of microneedle technology. His work focuses on developing devices that enhance medical applications through minimally invasive techniques.

Latest Patents

Nguyen holds a patent for a microneedle device that features a substrate with a plurality of microneedles projecting from it. The substrate is designed to be substantially spherical, allowing the microneedle device to exhibit three-dimensional movement during use. This innovative design aims to improve the efficacy and comfort of medical procedures involving microneedles.

Career Highlights

Duc-Viet Nguyen is affiliated with the National University of Singapore, where he conducts research and develops new technologies. His work has garnered attention for its potential to revolutionize drug delivery systems and other medical applications.

Collaborations

Nguyen has collaborated with notable colleagues, including Lifeng Kang and Yuanyuan Sun, to advance research in microneedle technology and its applications.

Conclusion

Duc-Viet Nguyen's contributions to microneedle technology exemplify the innovative spirit of modern inventors. His work not only enhances medical procedures but also paves the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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