Duane E Allen

Title: Duane E. Allen: Innovator in Solder Bump Process Technology

Introduction

Duane E. Allen is a notable inventor based in Milton, Vermont, who has made significant contributions to the field of solder bump processes. With a total of 2 patents to his name, Allen's work focuses on enhancing the precision and efficiency of mask and substrate alignment.

Latest Patents

One of Allen's latest patents is a system for aligning a mask to a substrate. This innovative system includes a fixture that holds both the mask and substrate in fixed positions relative to each other. It features means for holding the substrate that protrudes through openings in a table and the fixture. The holding mechanism is fixedly mounted on a stage that is movable in two directions and rotatable about an axis relative to the table. Additionally, the system includes means for affixing the fixture containing the mask and substrate to the table, as well as means for controlling the temporary affixing to generate a uniform force around the perimeter of the fixture. This ensures precise alignment of the mask to the substrate, enhancing the overall solder bump process.

Career Highlights

Duane E. Allen is currently associated with the International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of solder bump processes, which are critical in the manufacturing of electronic components.

Collaborations

Throughout his career, Allen has collaborated with notable colleagues, including Brian K. Burnor and Thomas A. Dotolo. These collaborations have contributed to the development of cutting-edge technologies in the field.

Conclusion

Duane E. Allen's contributions to the solder bump process technology reflect his dedication to innovation and excellence. His patents and work at IBM continue to influence the industry, showcasing the importance of precision in electronic manufacturing.