This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2015.
Company Filing History:
Years Active: 2015
Title: Du Sung Jung - Innovator in Printed Circuit Board Manufacturing
Introduction
Du Sung Jung is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of printed circuit board (PCB) manufacturing. His innovative methods have the potential to enhance the efficiency and effectiveness of PCB production.
Latest Patents
Du Sung Jung holds a patent titled "Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same." This patent outlines a method that includes forming a photo resist layer on a PCB with a seed layer, removing the photo resist layer according to a predetermined pattern, and forming a plating layer for a circuit. The process further involves exposing the seed layer and forming a corrosion layer through a chemical reaction, ultimately leading to the removal of the seed layer using laser irradiation.
Career Highlights
Du Sung Jung is associated with Samsung Electro-Mechanics Co., Ltd., where he applies his expertise in PCB technology. His work has contributed to advancements in manufacturing processes, making them more efficient and reliable.
Collaborations
He has collaborated with notable colleagues, including Sung Woo Han and Yoon Su Kim, to further enhance the innovation landscape within their field.
Conclusion
Du Sung Jung's contributions to PCB manufacturing through his patented methods demonstrate his commitment to innovation and excellence in technology. His work continues to influence the industry positively.