Douglas W Ormond

Title: Innovations by Douglas W. Ormond

Introduction

Douglas W. Ormond is an accomplished inventor based in Wappingers Falls, NY, known for his significant contributions to the field of metallurgy, with a focus on processes that enhance metal-to-substrate adhesion. With a total of two patents to his name, he has made strides in developing innovative methods that benefit various applications in the technology sector.

Latest Patents

Ormond's latest patents showcase his expertise in metallization processes. The first patent, titled "Thin film metallization process for improved metal to substrate adhesion," details a method for creating a metallization layer on substrates that significantly improves adhesion. This process involves depositing metal at elevated temperatures to promote the formation of chemical bonds with substrate materials, especially in polymer substrates. Enhanced adhesion is achieved through moisture removal and the deposition of a metal mixture with a variable chromium-to-copper ratio, monitored via optical emission spectroscopy.

His second patent, "Method for producing a plurality of layers of metallurgy," describes a selective deposition technique for multiple metal layers. This method outlines the process of creating a metallurgical structure that includes blanket metal and redundant metal layers, which are essential for producing effective electrical contacts on packaging substrates. The intricate steps involve the use of protective layers and etching techniques to define the final metallurgical design.

Career Highlights

Douglas W. Ormond is currently affiliated with the International Business Machines Corporation (IBM), where he has continued to innovate and apply his extensive knowledge of metallurgy and material science. His work has implications for the semiconductor industry and advanced electronics, reflecting his commitment to pushing the boundaries of technology.

Collaborations

Throughout his career, Ormond has collaborated with talented professionals, including Ingrid E. Magdo and Morris Anschel. These partnerships have fostered a dynamic environment for innovation, allowing for shared insights and advancements in their respective fields.

Conclusion

Douglas W. Ormond stands out as a notable inventor whose patented processes are shaping the future of metal adhesion technologies. Through his work at IBM and collaborations with dedicated colleagues, he exemplifies the spirit of innovation and the continuous pursuit of excellence in the realm of engineering and technology.