International Business Machines Corporation

Douglas W Ormond

Ingrid E Magdo

Morris Anschel

Carl P Hayunga

A metallization layer is formed on a substrate with improved adhesion thereto by performing the deposition at an elevated temperature which favors the formation of chemical bonds of the metal to the substrate as well as clusters of metal embedded within the substrate and contiguous with the metallization layer. In polymer substrates the chemical bond is made to carbonyl functional groups such as ketones or aldehydes. The adhesion is enhanced by the removal of moisture from the surface of the substrate at the elevated temperatures employed. A high degree of adhesion is also obtained through the deposition of a mixture of metals including chromium and copper which initially has a high chromium to copper ratio which is decreased during the deposition process. Completion of the process is determined by the reaching of a final desired chromium to copper ratio as observed by optical emission spectroscopy. The process can be carried out on a continuous basis by the use of a multi-chamber vacuum sputtering system.

Thin film metallization process for improved metal to substrate adhesion

A method for selectively depositing a plurality of metal layers on a substrate. The method includes the steps of depositing at least one layer of blanket metal on a surface of a substrate, building a lift-off stencil over the blanket metal, depositing at least one layer of redundant metal over the lift-off stencil, depositing a first etch-resistant barrier over the redundant metal, removing the lift-off stencil and the overlying layers of redundant metal and the etch-resistant barrier, depositing a second etch-resistant barrier over the blanket metal and the first etch-resistant barrier, and then reactive ion etching (RIE) the second etch-resistant barrier so as to expose the blanket metal and at least partially remove the second etch-resistant barrier from the first etch-resistant barrier. A final step of the method includes etching the blanket metal. Also disclosed is a metallurgical structure for a packaging substrate. The metallurgical structure includes layers of blanket metal and redundant metal. The redundant metal has an electrically isolating coating on its side but not on its top surface, thereby facilitating the electrical contact of the redundant metal with an electrical component.

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Wappingers Falls, NY, United States of America

Douglas W Ormond