Milton, GA, United States of America

Douglas R Hicks


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Douglas R Hicks: Innovator in Container Solutions

Introduction

Douglas R Hicks is a notable inventor based in Milton, GA (US). He has made significant contributions to the field of packaging solutions, particularly through his innovative designs for container carriers. With a total of 2 patents to his name, Hicks continues to push the boundaries of what is possible in the industry.

Latest Patents

One of Hicks' latest patents is for a "Carrier for Containers." This invention features a top retainer formed from a top container retention blank, which includes a top attachment panel designed to hold multiple containers. Additionally, the bottom retainer is crafted from a bottom container retention blank, featuring a bottom attachment panel that can be attached to the containers. The design includes several bottom container retention tabs that are foldably connected to the bottom attachment panel, allowing for secure attachment to each container. Notably, the top attachment panel remains free from attachment to the bottom attachment panel, enhancing the functionality of the carrier.

Career Highlights

Hicks is currently employed at Graphic Packaging International, Inc., where he applies his expertise in packaging design. His work has been instrumental in developing innovative solutions that meet the needs of various industries.

Collaborations

Some of his coworkers include Kevin T May and Raymond R Spivey, who contribute to the collaborative environment at Graphic Packaging International, Inc. Their combined efforts foster creativity and innovation within the company.

Conclusion

Douglas R Hicks exemplifies the spirit of innovation in the packaging industry. His contributions, particularly in the design of container carriers, showcase his commitment to improving functionality and efficiency. With his ongoing work, Hicks continues to inspire future advancements in packaging solutions.

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