Lancaster, PA, United States of America

Douglas R Eyman

This inventor holds 1 USPTO granted patent. Top assignee: Armstrong Cork Company. Active years: 1976.


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 1976

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1 patent (USPTO):Explore Patents

Title: Douglas R Eyman: Innovator in Decorative Surface Coverings

Introduction

Douglas R Eyman is a notable inventor based in Lancaster, PA (US). He has made significant contributions to the field of decorative surface coverings. His innovative approach has led to the development of a unique process that enhances the aesthetic appeal and functionality of surface materials.

Latest Patents

Eyman holds a patent for a "Process for forming decorative surface coverings." This process involves depositing a granular dryblend on a releasable carrier and applying heat to create a porous cohesive layer. Settable resinous inks are then used to form designs that may extend through the layer to the bottom surface. The process allows for a multi-level wear surface by selectively removing non-ink-containing portions of the dryblend, resulting in a durable and visually appealing product.

Career Highlights

Eyman is associated with Armstrong Cork Company, where he has applied his expertise in developing innovative surface covering solutions. His work has contributed to advancements in the industry, showcasing his commitment to quality and innovation.

Collaborations

Eyman has collaborated with Frank G Drout, further enhancing the creative and technical aspects of his projects. Their partnership has fostered a productive environment for innovation.

Conclusion

Douglas R Eyman's contributions to the field of decorative surface coverings exemplify the impact of innovation in material design. His patented process not only improves aesthetic qualities but also enhances the durability of surface materials.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
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