Company Filing History:
Years Active: 2023-2024
Title: Douglas Macfarlane: Innovator in Chip Scale Packaging
Introduction
Douglas Macfarlane is a notable inventor based in Edinburgh, GB. He has made significant contributions to the field of chip scale packaging, holding a total of two patents. His work has been influential in advancing technology in this area.
Latest Patents
Macfarlane's latest patents focus on a chip scale package (CSP). The first patent describes a CSP comprising a first set of CSP contact balls or bumps, a second set of CSP contact balls or bumps, and a channel routing region that is devoid of any CSP contact balls or bumps. This innovative design aims to enhance the efficiency and functionality of chip scale packages.
Career Highlights
Throughout his career, Douglas Macfarlane has worked with prominent companies such as Cirrus Logic Inc. and Cirrus Logic International Semiconductor Limited. His experience in these organizations has allowed him to develop and refine his expertise in semiconductor technology.
Collaborations
Some of his notable coworkers include Craig McAdam and Jonathan Taylor. Their collaboration has contributed to the successful development of various projects in the semiconductor industry.
Conclusion
Douglas Macfarlane's contributions to chip scale packaging and his collaborations with industry professionals highlight his importance as an inventor. His patents reflect a commitment to innovation and advancement in technology.