San Jose, CA, United States of America

Douglas Jeffery Lucken

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Douglas Jeffery Lucken. Retrieved from https://idiyas.com/inventor/douglas-jeffery-lucken

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Douglas Jeffery Lucken: Patent Inventor in Substrate Lapping

Introduction

Douglas Jeffery Lucken is an inventor based in San Jose, California. His patent work includes a method and system for lapping substrate row edges while compensating for substrate bow. He is associated with International Business Machines Corporation.

Latest Patents

Lucken is credited with 1 patent: “Lapping Method and System for Compensating for Substrate Bow.” The invention addresses the challenge of lapping row edges on a wafer section whose bow can vary between work pieces. It determines the work piece’s bow characteristics and selects load points where push pads apply pressure to flex the substrate and counteract that bow during lapping.

After a row edge is lapped, the row is sliced from the work piece, creating a new edge parallel to the lapped edge. The process can then be repeated using the same selected load points. As the substrate becomes shorter and its bow more pronounced, the applied pressure produces greater flex to help compensate for the changing bow.

Career Highlights

Lucken’s patent reflects work on precision manufacturing processes for wafer substrates. By accounting for substrate bow during lapping, the disclosed method aims to support consistent edge preparation as successive rows are processed.

Collaborations

Lucken’s listed coworkers include Michael Zung and Christopher Arcona. His patent is associated with International Business Machines Corporation.

Conclusion

Douglas Jeffery Lucken’s patented lapping method combines bow measurement, selected pressure points, and controlled substrate flex to address a practical challenge in wafer processing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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