This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 1996.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1996
Title: Douglas J Darrow: Innovator in Integrated Circuit Packaging
Introduction
Douglas J Darrow is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of integrated circuits, particularly through his innovative patent. His work has implications for the efficiency and effectiveness of electronic devices.
Latest Patents
Douglas J Darrow holds a patent for a "Package for integrated circuits." This invention includes a package base with a first top surface, a layer of material patterned to cover a portion of the base, and a microstrip transmission line on the second top surface. Additionally, a plastic encapsulant covers the first top surface of the base. This design enhances the functionality and reliability of integrated circuits.
Career Highlights
Darrow is associated with Texas Instruments Corporation, a leading company in the electronics industry. His role at Texas Instruments has allowed him to work on cutting-edge technologies that advance the field of integrated circuits.
Collaborations
Throughout his career, Douglas has collaborated with esteemed colleagues such as Glen R Haas and John E Barnett, Jr. These partnerships have fostered innovation and contributed to the development of advanced technologies in the industry.
Conclusion
In summary, Douglas J Darrow is a prominent inventor whose work in integrated circuit packaging has made a significant impact on the electronics industry. His contributions continue to influence the design and functionality of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
