Douglas C Smith

Title: Douglas C Smith: Innovator in Circuit Assembly Technology

Introduction

Douglas C Smith is a notable inventor based in Carmel, IN (US). He has made significant contributions to the field of circuit assembly technology, particularly through his innovative patent.

Latest Patents

Smith holds a patent for a "Circuit assembly encapsulated with polybutadiene urethane." This invention involves an acceleration sensor that is packaged in an open can and encapsulated in an elastomeric polybutadiene compound. This compound maintains its mechanical properties over a temperature range of -40°C to 105°C and effectively transmits acceleration to the sensor with a unity transfer function. The encapsulation material consists of approximately 90 to 100 parts by weight of polyol and about 20 parts by weight of isocyanate, with the polyol being at least 70% hydroxy-polybutadiene. To enhance adhesion, a foaming agent and/or an epoxy is added to the mixture. Smith's innovative approach has led to advancements in sensor technology.

Career Highlights

Throughout his career, Douglas C Smith has worked with prominent companies such as Delco Electronics Corporation and Hughes Aircraft Company. His experience in these organizations has contributed to his expertise in the field of electronics and sensor technology.

Collaborations

Some of his notable coworkers include Henry M Sanftleben and Ralph D Hermansen. Their collaboration has likely fostered an environment of innovation and creativity in their respective projects.

Conclusion

Douglas C Smith is a distinguished inventor whose work in circuit assembly technology has made a lasting impact. His patent for encapsulating acceleration sensors showcases his innovative spirit and technical expertise.