Doug Baumann

Title: Doug Baumann: Innovator in Bond Pad Technology

Introduction

Doug Baumann is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor technology, particularly in the area of bond pad arrangements. His innovative approach has led to advancements that improve the efficiency of flip-chip technology.

Latest Patents

Doug Baumann holds a patent for "Area Efficient Bond Pad Placement." This invention provides flip-chip bond pad arrangements that result in a smaller increase in die size compared to conventional methods. By utilizing the core side of a periphery I/O pad ring for placing some bond pads, he meets the bond pad pitch requirements of flip-chip technology. This innovative arrangement allows for alternating bond pads to be moved inward, thereby reducing the increase in die size from the edge of the I/O pad ring.

Career Highlights

Doug Baumann is currently employed at Zeevo, Inc., where he continues to develop and refine his innovative ideas. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and effective.

Collaborations

Doug collaborates with Louis Pandula, a fellow innovator in the field. Their combined expertise contributes to the ongoing development of cutting-edge technologies in the semiconductor industry.

Conclusion

Doug Baumann's contributions to bond pad technology exemplify the spirit of innovation in the semiconductor field. His patent for area-efficient bond pad placement showcases his commitment to improving technology and efficiency.